Small Footprint Inductive Coupling Coils For Contactless Secure Data Transmission
Shown below are Technology Demonstration devices where the
transmit and receive coils have been assigned to commercially available EEPROM chip dimensions
Can be custom tailored to your specific design requirements
Benefits compared to industry standard
Smaller footprint
Lower power consumption
Great field strength / force
Ability to fabricate 2 layer coils
Enable by high aspect ratio copper process
Ability to fabricate "in-package" in a higher level component
High density inductive coils enables small footprint contactless communication
Low electromagnetic emissions and low susceptibility to RF fields
Perfect for small devices that could benefit from contactless data transmission
Small Footprint, High Power Coil Inductor for Contactless Power Transfer
Shown below is a Technology Demonstration Device in which harvested power illuminates a pair of LEDs
Can be customer tailored to your specific design requirements
Benefits compared to industry standard
Ability to fabricate 'in-package' in a higher level component
Ability to achieve much higher L/R ratio compared to traditional flex processes
Single or Double Layer Coil Inductor for Near Field Power Transfer
Ability to fabricate 'in-package' in a higher level component
High density copper trace optimizes inductance relative to resistance
Much higher L/R ratio compared to traditional flex processes
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