Physical Vapor Deposition is a process for applying very thin layers of material. The process provides superior uniformity, adhesion, and process flexibility. Physical Vapor Deposition is typically used to deposit pure metals. However, alloys, ceramics, and in some cases polymers, can be sputter deposited.

    Capabilities :

• DC, RF, and reactive sputtering
• Standard DC magnetron sputter deposition involves accelerating inert gas ions in plasma toward a target in a vacuum chamber. As the inert gas atoms collide with the target, some of the target material is liberated into the vacuum chamber and condenses onto the substrate that you wish to coat.
• Reactive sputter deposition is similar, except a precise amount of reactive gas is supplied in addition to the inert gas to react with the liberated target material and form non-metallic materials such as titanium nitride and chromium oxide.
• Electrically insulating materials such as aluminum oxide and Teflon can also be deposited via radio-frequency or RF sputtering.

    In our laboratories and production facilities, we have numerous pieces of equipment with varying capabilities that allow us to experiment with new techniques and materials, produce piece parts in small to medium volume, and produce large volumes of material in roll-to-roll format. Our most fundamental tool is capable of performing evaporation and DC, RF, or reactive sputtering with tunable in-situ ion treatment.

    Coating Property Measurement:

• Sheet resistance measurements to measure electrical properties
• Visible light characterization of color and reflectivity
• Micropeel testing for adhesion

    Sputter deposition of thin films can be used for a variety of applications. Sputter deposited coatings can be a cost effective way to improve wear, reflectivity, aesthetics, corrosion resistance, permeability resistance, adhesion, friction, surface energy, electrical conductivity, and more.